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Manufacturing Letters

Manufacturing Letters

Archives Papers: 311
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Customized disassembly and processing of waste electrical and electronic equipment
S. Wang; W.D. Li; K. Xia;
Abstracts:A new customized disassembly and processing approach for waste electrical and electronic equipment (WEEE) based on the Analytic Hierarchy Process (AHP) and Particle Swarm Optimization (PSO) algorithms is presented. The merits of the approach include the flexibility to handle WEEE to meet various requirements of stakeholders, and the capability to optimize WEEE processing selectively. The feasibility of the approach has been verified through an industrial case of Liquid Crystal Display (LCD) television WEEE processing. The case study shows that with the selective optimized plan, the potential recovery values during the disassembly process can be improved at least two times.
Investigations on structural thinning and compensation stratagem in deformation machining stretching mode
Arshpreet Singh; Anupam Agrawal;
Abstracts:Deformation machining (DM) is a combination of thin structure machining and single point incremental forming/bending. This process enables creation of monolithic structures with complex geometries employing conventional tooling. Structural thickness influences the strength and stiffness of the formed component. In this study, experimental and numerical (finite element) investigations on structural thinning in DM stretching mode have been performed. Structural thinning was found to be highly non uniform along the forming depth at varying forming angles. A compensation strategy in thin structure machining has been proposed to obtain uniform structural thickness in incremental forming.
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