Most thermal plasma applications involve interactions between the plasma and solid or liquid surfaces. Computational models of thermal plasma applications typically consider the influence of the plasma on the surface, but often neglect the effect of the surface on the plasma. In many cases, however, it is not possible to accurately model the plasma process without taking the two-way interactions into account. This is demonstrated using examples from arc welding, plasma cutting, plasm­a-particle interactions, such as occur in plasma spheroidization, plasma nanoparticle production and plasma spraying, and high- and low-voltage circuit breakers. Vaporization of metal, ceramic and polymer surfaces, transfer of heat and momentum from the plasma to particles and droplets, and changes in the surface shape are all shown to affect the properties of the plasma. The effect of materials on the plasma is often neglected in computational models of thermal plasma applications, even though most models consider the influence of the plasma on the surface. However, in many applications (including plasma cutting, spheroidization, nanoparticle production and spraying, arc welding and circuit interruption), effects such as vaporization of the surface material and heat transfer to particles mean that two-way interactions are critical.

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vaporization of the surface material polymer twoway interactions computational models arc welding plasma cutting plasmaparticle interactions circuit solid or liquid high and lowvoltage circuit breakers vaporization of metal ceramic surface however plasma cutting spheroidization nanoparticle production

Anthony B. Murphy, Hunkwan Park,.Modeling of Thermal Plasma Processes: The Importance of Two-Way Plasma-Surface Interactions. 14 (1-2),.

Anthony B. Murphy, Hunkwan Park,"Modeling of Thermal Plasma Processes: The Importance of Two-Way Plasma-Surface Interactions" 14

Anthony B. Murphy, Hunkwan Park,"Modeling of Thermal Plasma Processes: The Importance of Two-Way Plasma-Surface Interactions"