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Journal of The Institution of Engineers (India): Series C | Vol.101, Issue.2 | 2020-03-31 | Pages 375-382

Journal of The Institution of Engineers (India): Series C

Thermal and Flow Analysis of Split Drop-Shaped Pin Fins for Improved Heat Transfer Rate

Alok Ranjan   Surendra Singh Yadav   Koushik Das  
Abstract

Proper dissipation of thermal energy has always been a requirement for better efficiency of a system. Fins provide additional surfaces to reject heat to th

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Thermal and Flow Analysis of Split Drop-Shaped Pin Fins for Improved Heat Transfer Rate

Proper dissipation of thermal energy has always been a requirement for better efficiency of a system. Fins provide additional surfaces to reject heat to th

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Alok Ranjan,Surendra Singh Yadav,Koushik Das,.Thermal and Flow Analysis of Split Drop-Shaped Pin Fins for Improved Heat Transfer Rate. 101 (2),375-382.

References

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W.A. Khan, J.R. Culham, M.M. Yovanovich, Modelling of cylindrical pin-fin heat sinks for electronic packaging. IEEE Trans. Compon. Packag. Technol. 31–3, 1521–3331 (2008)

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